TRI TR7007D Solder Paste Inspection

Optical & Imaging System

Camera Type: 4 or 8 or 12 Mpix camera (factory setting) 

Optical Resolution: 6 μm or 8 μm or 10 μm or 15 μm (factory setting) 

3D Projection: Dual Digital Fringe Projectors

Inspection Functions

Defects Detected: Insufficient Paste, Excessive Paste, Shape Deformity, Missing Paste & Bridging

Measurement: Height, area, volume and offset

Mechanical Stage

XY-axis ball screw with DSP-based motion controller

XY Resolution: 1 μm (up to 0.5 μm with optional linear encoder) 

Z Resolution: 1 μm (up to 0.5 μm with optional linear encoder)

Inspection Speed 

Camera Resolution/ Imaging Speed FOV/sec

4 Mpix/3

8 Mpix/2

12 Mpix/2

PCB and Conveyor System

Min. PCB Size: 50 x 50 mm (1.97 x 1.97 in)

Max. PCB Size: 510x460mm(20.1x18.1 in)

PCB Thickness: 0.6 - 5 mm (0.02 - 0.20 in)

PCB Transport Height: 880 - 920 mm (34.6 - 36.2 in)

Max. PCB Weight: 3 kg (6.61 lbs)

PCB Carrier/Fixing: Belt/Pneumatic

Clearance

Top: 25 mm (0.98 in)

Bottom: 40 mm (1.58 in)

Edge: 3 mm (0.12 in)

Dimensions

Dimensions (W x D x H): 1000 x 1400 x 1647 mm (39.4 x 55.1 x 64.8 in) (not including signal tower, height: 520 mm)

Weight: 675 kg (1489 lbs)

Power Requirement: 200 - 240 V, single phase, 50/60 Hz, 3 kVA

Air Requirement: 0.6 MPa (87 psi)

Datasheet