Shuttlestar SV-650A BGA Rework Station

- PCB & Component Requirements

Max.PCB size: 540mm x450mm

Max.PCB thickness: 0.5~4mm

Max.BGA size: 80mm x 80mm

Min.BGA size: 4mm x 4mm

Max. BGA weight: 80g

- Vision System Specifications

Max. visible area: 40mm x 40mm

Min. Pitch: /0.15mm

Micrometer Adjust Range: Front/Rear ± 5mm Left/Right ± 5mm

Rotation Angle: 360°

- Thermal Specifications

Max.temp.for hot-air heater: 350° C

Max.temp.for IR heater: 400° C

Temperature control: 8-Stage Programmable Temperature Settings

Upper heater power: 1200W

Lower heater power: 800W

Bottom IR heater power: 3600W

- Dimensions & Power Requirements:

Machine dimension: 746mm (L) 710mm (W) 820mm (H)

Weight: Appox 90Kg

Power Requirements: Single Phase, 220VAC, 50/60 Hz,

Datasheet