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Heater (top side): Medium/Long Wave IR, 500W
Bottom Heater with adjustable: working heightMedium/Long Wave IR, 1000W 220 x 155mm (8.6" x 8.6")
Max Component Size: 65 x 65mm (2.5" x 2.5")
Max PCB Size: 305 x 305mm (12" x 12")
Resolution on Optics Adjustment: 0.52mm (0.02") per rotation
Positioning Accuracy :(Z axis)± 25 µmeters (0.001")
VaCuum: 450mm Hg
Power Requirements: 230 VAC, 50 Hz (2000 w max)
Optics: High resolution, Vision Overlay System with colour camera
Video inputs: 2 Composite (B/C) and 1 "S" Video (For alignment optics)
Temperature setting range:
Top Heater: 100°to 400°C (212°to 750°F)
Bottom Heater: 100°to 221°C (212°to 430°F)
The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3000 does not require heat-focusing nozzles, saving you thousands in additional costs. Instead, it uses a unique aperture system to control and precisely apply the heat to protect adjacent components. Using a high quality, specially developed IR thermal sensor, the process is completely closed loop temperature controlled using non-contact measuring methods. Sodr-Cam Reflow Process Observation Camera allows you to watch the entire reflow process happen in real time.
The IR 3000 fully integrated software and step-by-step instructions makes profiling incredibly simple for even the most advanced BGA and CSP applications. The software is unique in that it uses PACE-exclusive, custom developed, PID controllers to control user determined ramp rates by selecting the time and the end temperature for each phase and provides intuitive set-up, multi-stage profiling, On-the-Fly profile adjustment, flux-dipping, and much more.
The bottom preheater features an incredibly efficient, high power, quick response quartz IR emitter that is adjustable when more power is required for high thermal mass applications. The preheater can be adjusted from its standard position up to 38mm (1.5") closer to the PCB for those applications where additional heat is desired or needed! This is a unique PACE feature designed especially for use with Lead-Free processes and your highest-mass, heat-sinking PCB!
Sodr-Cam Reflow Process Observation Camera
Vision Overlay System (VOS) for Precision Optical Alignment
Automated Flux Dipping Tray
Precision PCB Holder
Adjustable Component Centering Nest
