Nordson SQ3000+ Automated Optical Inspection

Inspection Speed: 16 cm2/sec (2D+3D)

Minimum Component Size: 0201 mm (008004 in.)

PCB Size: Minimum 50 x 50 mm (2 x 2 in.); Maximum: 420 x 320 mm (16.5 x 12.5 in.)

Component Height Clearance: Top: 20 mm ; Bottom: 50 mm

PCB Thickness: 0.1 - 5 mm

Component Types Inspected: Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more

Component Defects: Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more

Solder Joint and Other Defects: Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins

3D Measurement Inspection: Lifted Lead, package coplanarity, polarity dimple and chamfer identification

Measurement Gage R&R: <10% @ ±3σ (±30 μm process tolerance)

Z Height Accuracy & Measurement Range: Z Height Accuracy: 0.5 μm on certification target • Z Height Measurement Range: 400 μm at spec, 2.4 mm capability

CMM Capabilities

Accuracy & Resolution XY / Z: Accuracy XY / Z: 2 μm / 0.5 μm • Resolution XY / Z: 5 μm / 0.1 μm

Maximum Weight: 10 kg

Min./ Max. Feature Height: Min. 10 μm ; Max. 400 μm at spec, 2.4 mm capability

Maximum Feature Size: 420 x 320 mm (16.5 x 12.5 in.)

Carrier Thickness 0.1 - 5 mm

Coordinate Measurement Capability: Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset, X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius, Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max / Min / Ave / Sigma / Plus / Minus / Multiple

Vision System & Technology

Imagers: Multi-3D sensors

Resolution: 5 μm

Field of View (FOV): 25 x 25 mm

Image Processing: Autonomous Image Interpretation (AI2) Technology, Coplanarity and Lead Measurement

Programming Time: <13 minutes (for established libraries)

CAD Import: Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation

System Specifications

Machine Interface: SMEMA, RS232 and Ethernet

Power Requirements: 100-120 VAC or 220-240 VAC (±10%), 50/60 hz, 10-15 amps

Compressed Air Requirements: 5.6 Kgf/cm2 to 7.0 Kgf/cm2 (80 to 100 psi @ 4 cfm)

System Dimensions: 135 x 148 x 175 cm (W x D x H)

Weight: 2350kg (5180 lbs.)

Options

Barcode Reader, Rework station, CyberReport SPC Software, Alignment Target

SQ3000™, SQ3000™ X (Large Board), SQ3000™ D (Dual Lane), and SQ3000™ DD (Dual Lane - Dual Sensor) models available

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