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AC Input:
Input voltage range: 100–240 VAC
Input frequency: 50/60 Hz
DC Output:
Total DC output power:
1170W / 1000W (0°C ~ 45°C, 220/110VAC)
990W / 790W (45°C ~ 55°C, 220/110VAC)
Cooling:
Fans: 3 × 220 CFM
System slot cooling capacity: 150W
Peripheral slot cooling capacity:
38W (Normal fan mode, max ambient 55°C)
50W (Boosted fan mode, max ambient 55°C)
82W (Boosted fan mode, max ambient 45°C, adjacent modules ≤50W each side)
Size & Weight:
Dimensions: 444.4 × 177.8 × 480.5 mm
Net weight: 12 kg
Gross weight: 15 kg
Operating Environment:
Temperature: 0°C to +55°C
Humidity: 10% to 90% (non-condensing)
Storage Environment:
Temperature: -20°C to +70°C
Humidity: 10% to 90% (non-condensing)
Shock and Vibration:
Designed shock: 30G, half-sine, 11 ms
Random vibration:
Operation: 0.3 Grms, 5–500 Hz, 3 axes
Non-operation: 2.46 Grms, 5–500 Hz, 3 axes
The PXC1191 is a high-performance 18-slot PXI Express chassis featuring PCI Express 3.0 technology, delivering a system bandwidth of 24 GB/s for high-throughput, point-to-point data transfer applications. All peripheral slots support up to 8 GB/s bandwidth. Additionally, the chassis provides a total power of 1170W, with a per-slot cooling capacity of 50W/82W, ensuring a higher power budget for high-performance PXI modules.
The PXI Express timing and synchronization features offer high clock accuracy along with external clock and trigger routing capabilities.
The PXC1191 is equipped with an intelligent monitoring system that tracks and reports chassis status, including fan speed, system voltage, and internal temperature. Remote monitoring and control can be achieved via an Ethernet port.