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Type: RLDRAM3
Density: 576 Mbit
Package: 168BGA
Mounting: Surface Mount
DRAM Type: RLDRAM3
Pin Count: 168
Lead Finish: Tin-Silver-Copper
No. of Pins: 168
Organization: 16M x 36
Data Bus Width: 36 Bit
Memory Density: 576 Mbit
Number of Banks: 16
Screening Level: Commercial
Supplier Package: BGA
Address Bus Width: 23 Bit
Maximum Clock Rate: 933 MHz
Product Dimensions: 13.5 x 13.5 x 0.9 mm
Supply Voltage Nom: 1.35 V
Clock Frequency Max: 933 MHz
Max Processing Temp: 260 °C
Number of I/O Lines: 36 Bit
Operating Temperature: 0 to 95 °C
Number of Bits per Word: 36 Bit
Operating Supply Voltage: 1.3500 V
Maximum Operating Current: 985 mA
Operating Temperature Max: 95 °C
Operating Temperature Min: 0 °C
Maximum Random Access Time: 10 ns
