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Density: 128 Gbit
Package: Wafer
Rad Hard: No
Cell Type: MLC NAND
Boot Block: No
Interfaces: Parallel
ECC Support: No
Architecture: Sectored
Interface Type: Parallel
Memory Density: 128 Gbit
Number of Words: 16 Gwords
Screening Level: Commercial
Supplier Package: WAFER
Supply Voltage Nom: 3.3 V
Max Processing Temp: 260 °C
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: 0 to 70 °C
Number of Bits per Word: 8 Bit
Operating Temperature Max: 70 °C
Operating Temperature Min: 0 °C
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 3.3000 V
Erase Suspend/Resume Modes Support: No
