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Density: 256 Gbit
Package: 152VBGA
Mounting: Surface Mount
Rad Hard: No
Cell Type: MLC NAND
Pin Count: 152
Boot Block: No
Access Time: 20 ns
ECC Support: Yes
Lead Finish: Tin-Silver-Copper
No. of Pins: 152
Architecture: Sectored
Interface Type: Parallel
Memory Density: 256 Gbit
Number of Words: 32 Gwords
Program Current: 50 mA
Screening Level: Commercial
Supplier Package: VBGA
Block Organization: Symmetrical
Maximum Erase Time: 0.025/Block s
Product Dimensions: 14 x 18 x 0.65 mm
Supply Voltage Max: 3.6 V
Supply Voltage Min: 2.7 V
Supply Voltage Nom: 3.3 V
Clock Frequency Max: 333 MHz
Max Processing Temp: 260 °C
Operating Temperature: 0 to 70 °C
Number of Bits per Word: 8 Bit
Maximum Programming Time: 3.7/Page ms
Maximum Operating Current: 50 mA
Operating Temperature Max: 70 °C
Operating Temperature Min: 0 °C
Maximum Random Access Time: 20 ns
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 3.3000 V
Erase Suspend/Resume Modes Support: Yes
