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Type: Mobile LPDDR3 SDRAM
Density: 24 Gbit
Package: 216VFBGA
Mounting: Surface Mount
DRAM Type: Mobile LPDDR3 SDRAM
Pin Count: 216
Lead Finish: Tin-Silver-Copper
No. of Pins: 216
Organization: 384M x 64
Data Bus Width: 64 Bit
Memory Density: 24 Gbit
Screening Level: Wireless
Supplier Package: VFBGA
Maximum Clock Rate: 933 MHz
Supply Voltage Nom: 1.2 V
Clock Frequency Max: 933 MHz
Max Processing Temp: 260 °C
Number of I/O Lines: 64 Bit
Operating Temperature: -30 to 85 °C
Number of Bits per Word: 64 Bit
Operating Supply Voltage: 1.2000 V
Operating Temperature Max: 85 °C
Operating Temperature Min: -30 °C
