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Type: Mobile LPDDR3 SDRAM
Density: 16 Gbit
Package: 178FBGA
Mounting: Surface Mount
DRAM Type: Mobile LPDDR3 SDRAM
Pin Count: 178
Lead Finish: Tin-Silver-Copper
No. of Pins: 178
Organization: 512M x 32
Data Bus Width: 32 Bit
Memory Density: 16 Gbit
Supplier Package: FBGA
Address Bus Width: 14 Bit
Maximum Clock Rate: 800 MHz
Product Dimensions: 13 x 11.5 x 0.81
Supply Voltage Nom: 1.8 V
Clock Frequency Max: 800 MHz
Max Processing Temp: 260
Number of I/O Lines: 32 Bit
Operating Temperature: -30 to 85 °C
Number of Bits per Word: 32 Bit
Operating Supply Voltage: 1.2, 1.8 V
Maximum Operating Current: 120 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -30 °C
