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Type: Mobile LPDDR2 SDRAM
Density: 8 Gbit
Package: 216FBGA
Mounting: Surface Mount
DRAM Type: Mobile LPDDR2 SDRAM
Pin Count: 216
Lead Finish: Tin-Silver-Copper
No. of Pins: 216
Organization: 256M x 32
Data Bus Width: 32 Bit
Memory Density: 8 Gbit
Number of Banks: 8
Screening Level: Industrial
Supplier Package: FBGA
Maximum Clock Rate: 400 MHz
Product Dimensions: 12 x 12 x 0.79 mm
Clock Frequency Max: 400 MHz
Max Processing Temp: 260 °C
Number of I/O Lines: 32 Bit
Memory Configuration: 256M x 32bit
Operating Temperature: -30 to 85 °C
Number of Bits per Word: 32 Bit
Operating Supply Voltage: 1.8000 V
Operating Temperature Max: 85 °C
Operating Temperature Min: -30 °C
