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MANNCORP 850 Desktop Reflow Oven

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pplicable Solder Types

Lead-Free and Leaded
PCB Size (Max.)13" (330 mm) x 9.4" (240 mm)
Heating MethodForced Hot Air Convection;
Resistance Heaters
Min / Max TemperaturesPreheat stage: 50°C/230°C
Reflow stage: 60°C/260°C
Temperature Control MethodPID Control; ±1.5%
Warm-up Time90°C/min
ProgrammingLCD Touchscreen
Power220 V, Single Phase, 50/60 Hz
1.5 KW; 4 KW (max.)
Air Supply60 psi (4 bar)
Dimensions27.4" L x 21.2" W x 16.1" H
(695 mm L x 540 mm W x 410 mm H)
Weightapprox. 55 lbs. (25 Kg)
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