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Pitch: 0.6 mm (0.024 in)
Application: Datacom Systems, Enterprise Servers, telecommunications,
Stack Height: 10 mm
Current Rating: 500 mA
Mounting Angle: Straight
Mounting Style: PCB Mount
Number of Rows: 4 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Thermoplastic (TP)
Termination Style: Solder
Number of Positions: 280 Position
Insulation Resistance: 1 GOhms
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 55 C
