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Density: 128 Mbit
Package: 56TSOP
Mounting: Surface Mount
Rad Hard: No
Bank Size: 16/16/48/48 Mbit
Cell Type: NOR
MSL Level: MSL 3 - 168 hours
Pin Count: 56
Boot Block: Yes
Interfaces: Parallel
Access Time: 60 ns
ECC Support: No
Lead Finish: Matte Tin
No. of Pins: 56
Architecture: Sectored
Interface Type: Parallel
Memory Density: 128 Mbit
OE Access Time: 25 ns
Number of Words: 8 MWords
Program Current: 25 mA
Screening Level: Industrial
Supplier Package: TSOP
Address Bus Width: 23 Bit
Page Read Current: 15 mA
Block Organization: Asymmetrical
Maximum Erase Time: 216/Chip s
Product Dimensions: 14 x 18.4 x 1 mm
Supply Voltage Nom: 3, 3.3 V
Max Processing Temp: 260
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: -40 to 85 °C
Location Of Boot Block: Bottom|Top
Number of Bits per Word: 16 Bit
Maximum Page Access Time: 25 ns
Maximum Programming Time: 200000/Chip ms
Maximum Operating Current: 55 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 60 ns
Simultaneous Read/Write Support: Yes
Typical Operating Supply Voltage: 3, 3.3 V
Erase Suspend/Resume Modes Support: Yes
