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Density: 512 Mbit
Package: 64FBGA
Mounting: Surface Mount
Rad Hard: No
Cell Type: NOR
MSL Level: MSL 3 - 168 hours
Pin Count: 64
Boot Block: Yes
Access Time: 100 ns
ECC Support: No
Lead Finish: Tin-Silver-Copper
No. of Pins: 64
Architecture: Sectored
Interface Type: Parallel
Memory Density: 512 Mbit
OE Access Time: 25 ns
Number of Words: 64, 32 MWords
Program Current: 100 mA
Screening Level: Industrial
Supplier Package: FBGA
Address Bus Width: 25 Bit
Page Read Current: 25 mA
Block Organization: Symmetrical
Maximum Erase Time: 1792/Chip s
Product Dimensions: 13 x 11 x 1(Max)
Supply Voltage Max: 3.6 V
Supply Voltage Min: 2.7 V
Supply Voltage Nom: 3 V
Max Processing Temp: 260
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: -40 to 85 °C
Location Of Boot Block: Bottom|Top
Number of Bits per Word: 8, 16 Bit
Maximum Page Access Time: 15 ns
Maximum Programming Time: 192/Sector ms
Maximum Operating Current: 60 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 100 ns
Simultaneous Read/Write Support: No
Maximum Operating Supply Voltage: 3.6 V
Typical Operating Supply Voltage: 3.0000 V
Erase Suspend/Resume Modes Support: Yes
