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Density: 256 Mbit
Package: 56TSOP
Mounting: Surface Mount
Rad Hard: No
Cell Type: NOR
MSL Level: MSL 3 - 168 hours
Pin Count: 56
Boot Block: No
Access Time: 110 ns
ECC Support: No
Lead Finish: Matte Tin
No. of Pins: 56
Architecture: Sectored
Interface Type: Parallel
Memory Density: 256 Mbit
OE Access Time: 25 ns
Number of Words: 32, 16 MWords
Program Current: 90 mA
Screening Level: Industrial
Supplier Package: TSOP
Address Bus Width: 25, 24 Bit
Page Read Current: 10 mA
Block Organization: Symmetrical
Maximum Erase Time: 512/Chip s
Product Dimensions: 14 x 18.4 x 1 mm
Supply Voltage Max: 3.6 V
Supply Voltage Min: 2.7 V
Supply Voltage Nom: 3 V
Max Processing Temp: 260
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: -40 to 85 °C
Number of Bits per Word: 8, 16 Bit
Maximum Page Access Time: 25 ns
Maximum Programming Time: 246000/Chip ms
Maximum Operating Current: 110 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 110 ns
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 3, 3.3 V
Erase Suspend/Resume Modes Support: Yes
