Get exclusive volume discounts, bulk pricing updates, and new product alerts delivered directly to your inbox.
By subscribing, you agree to our Terms of Service and Privacy Policy.
Direct access to our certified experts
Density: 64 Mbit
Package: 48FBGA
Mounting: Surface Mount
Rad Hard: No
Cell Type: NOR
MSL Level: MSL 3 - 168 hours
Pin Count: 48
Boot Block: Yes
Interfaces: Parallel
Access Time: 90 ns
ECC Support: No
Lead Finish: Tin-Lead
No. of Pins: 48
Architecture: Sectored
Interface Type: Parallel
Memory Density: 64 Mbit
OE Access Time: 25 ns
Number of Words: 8 MWords
Program Current: 60 mA
Screening Level: Industrial
Supplier Package: FBGA
Address Bus Width: 23, 22 Bit
Page Read Current: 20 mA
Block Organization: Symmetrical
Maximum Erase Time: 128/Chip s
Product Dimensions: 8.15 x 6.15 x 0.76 mm
Supply Voltage Nom: 3, 3.3 V
Max Processing Temp: 260
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: -40 to 85 °C
Location Of Boot Block: Bottom
Number of Bits per Word: 8, 16 Bit
Maximum Page Access Time: 25 ns
Maximum Programming Time: 63000/Chip ms
Maximum Operating Current: 50 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 90 ns
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 3, 3.3 V
Erase Suspend/Resume Modes Support: Yes
