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Density: 256 Mbit
Package: 24BGA
Mounting: Surface Mount
Rad Hard: No
Cell Type: NOR
MSL Level: MSL 3 - 168 hours
Pin Count: 24
Boot Block: Yes
Access Time: 14.5 ns
ECC Support: No
Lead Finish: Tin-Silver-Copper
No. of Pins: 24
Architecture: Sectored
Interface Type: Serial-SPI
Memory Density: 256 Mbit
Number of Words: 256 MWords
Program Current: 100 mA
Screening Level: Industrial
Supplier Package: BGA
Address Bus Width: 32 Bit
Block Organization: Symmetrical
Maximum Erase Time: 165/Chip s
Product Dimensions: 8 x 6 x 0.9(Max)
Supply Voltage Max: 3.6 V
Supply Voltage Min: 2.7 V
Supply Voltage Nom: 3 V
Clock Frequency Max: 133 MHz
Max Processing Temp: 260
Programming Voltage: 2.7 to 3.6 V
Operating Temperature: -40 to 85 °C
Location Of Boot Block: Bottom|Top
Number of Bits per Word: 1 Bit
Maximum Programming Time: 0.75/Page ms
Maximum Operating Current: 33 mA
Operating Temperature Max: 85 °C
Operating Temperature Min: -40 °C
Maximum Random Access Time: 8 ns
Simultaneous Read/Write Support: No
Typical Operating Supply Voltage: 3.0000 V
Erase Suspend/Resume Modes Support: Yes
