Foxconn Interconnect Technology (FIT) JFM38U1B-B313-4F Conn RJ45/Combo USB3.0 RCP 8/4/4 POS 1.27mm/2mm Solder RA Through Hole Tray
ModelJFM38U1B-B313-4F
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Type: RJ45|Combo USB3.0
Pitch: 1.27|2 mm
Gender: RCP
Mounting: Through Hole
Series Name: JFM
Product Depth: 27.3 mm
Product Height: 31.05 mm
Product Length: 19.02 mm
Body Orientation: Right Angle
Contact Material: Phosphor Bronze
Number of Contacts: 8|4|4
Product Dimensions: 19.02 x 27.3 x 31.05 mm
Termination Method: Solder
Max Processing Temp: 265 °C
Base/Housing Material: PBT (Polybutylene Terephthalate)
Operating Temperature: -30 to 85 °C
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