Foxconn Interconnect Technology (FIT) DZ11A51-H8R1-4F Conn High Density D Subminiature RCP 15 POS Solder RA Through Hole
ModelDZ11A51-H8R1-4F
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Gender: Receptacle
Mounting: Through Hole
Lead Finish: Gold Flash
Product Depth: 10.57 mm
Number of Rows: 3
Product Height: 10 mm
Product Length: 30.8 mm
Contact Plating: Gold Flash
Body Orientation: Right Angle
Contact Material: Copper Alloy
Number of Contacts: 15
Product Dimensions: 30.8 x 10.57 x 10 mm
Termination Method: Solder
Base/Housing Material: Thermoplastic
Operating Temperature: -20 to 85 °C
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