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Pitch: 1 mm (0.039 in)
Data Rate: 25 Gbps
Unit Weight: 850 mg
Stack Height: 1 mm
Current Rating: 1 A
Mounting Angle: Vertical
Number of Rows: 2 Row
Contact Plating: Gold
Contact Material: Copper Alloy
Housing Material: Liquid Crystal Polymer (LCP)
Maximum Data Rate: 25 Gbps
Termination Style: Solder
Number of Positions: 50 Position
Insulation Resistance: 100 GOhms
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 55 C
