DINGHUA TECHNOLOGY DH-5830 BGA rework machine (5200W)

Total Power: 5200W

Top Heater: 1200W

Bottom Heater: 2nd 1200W, 3rd IR heater 2800W

Power: AC220V ±10%, 50Hz

Lighting: Taiwan LED working light, adjustable at any angle

Operation Mode: HD touch screen, intelligent conversational interface, digital system setting

Top Air-flow Knob: For upper hot-air flow adjustment (especially for very small/big chips)

Storage: 50,000 groups

Top Heater Movement: Right/left, forward/backward, freely rotatable

Positioning: Intelligent positioning; PCB can be adjusted in X, Y direction with “5 points support” + V-groove PCB bracket + universal fixtures

Temperature Control: K sensor, closed loop

Temperature Accuracy: ±2°C

PCB Size: Max 410 × 370 mm, Min 22 × 22 mm

BGA Chip: 2 × 2 – 80 × 80 mm

Minimum Chip Spacing: 0.15 mm

External Temperature Sensor: 1 pc

Dimensions: 570 × 610 × 570 mm

Net Weight: 33 kg

Datasheet