congatec conga-QMX6/HSP3-T Component Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.

Name: congatec conga-QMX6/HSP3-T Component Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
Brand: congatec

Manufacturercongatec(View more products from this manufacturer)

Modelconga-QMX6/HSP3-T

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congatec conga-QMX6/HSP3-T Component Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.

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