congatec conga-QMX6/HSP3-T Component Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
Manufacturercongatec(View more products from this manufacturer)
Modelconga-QMX6/HSP3-T
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Designed for: BGA
Mounting Style: Screw
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