Bungard Elektronik Splash Center Spray etching machine

Professional spray etching technology

Line resolution: down to 100 µm

Standard etching rate (FeCl₃): 35 µm Cu in 90 sec

Max. PCB size:

210 × 300 mm (SPLASH Center)

300 × 400 mm (SPLASH Center XL)

Spray pump: Magnetic type

Integrated heating system: 1000 W with temperature control and overheat protection

Safety cover

Digital timer: countdown, auto reset, acoustic alarm

Also suitable for spray developing

Special PCB holder (Titanium) with drop-in position

Technical Data:

Power supply: 230 V~, 50 Hz, approx. 1150 VA

Dimensions (L × W × H):

100 × 67 × 121 cm (SPLASH Center)

110 × 77 × 120 cm (SPLASH Center XL)

Tank volumes:

SPLASH Center: 1 × 25 l + 3 × 7 l + 1 × 9 l

SPLASH Center XL: 1 × 40 l + 1 × 24 l + 3 × 15 l

Weight:

SPLASH Center: 46 kg

SPLASH Center XL: 56 kg