Bungard Elektronik Splash Spray etching machine

Professional spray etching technology, line resolution down to 100 µm

Standard etching rate (FeCl₃): 35 µm Cu in 90 sec

Max. PCB size:

210 × 300 mm (SPLASH)

300 × 400 mm (SPLASH XL)

Spray pump: Magnetic type

Integrated heater: 1000 W with temperature control & overheat protection

Safety: Cover interlock switch

Digital timer: countdown, auto reset, acoustic alarm

Special PCB holder (Titanium) with drop-in position

Integrated rinsing spray

Also suitable for spray developing

Technical Data:

Power supply: 230 V~, 50 Hz, approx. 1150 VA

Dimensions (L × W × H):

60 × 66 × 120 cm (SPLASH)

80 × 120 × 65 cm (SPLASH XL)

Tank volume:

25 l (SPLASH)

40 l (SPLASH XL)

Weight:

30 kg (SPLASH)

40 kg (SPLASH XL)