Boyd 10-5607-04G Heat Sink Passive BGA/FPGA Square PCB Mount 0.05°C/W Aluminum

Name: Boyd 10-5607-04G Heat Sink Passive BGA/FPGA Square PCB Mount 0.05°C/W Aluminum
Brand: Boyd

Model10-5607-04G

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Type: Passive

Material: Aluminum

Mounting: PCB Mount

Fin Style: Square

Lead Finish: Matte Tin

Device Cooled: BGA|FPGA

Attachment Method: Push Pin

Product Dimensions: 37.4 x 37.4 x 10 mm

Thermal Resistance: 0.05 °C/W

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